Books Published
1. Published a Book on "Modelling and Simulation of CNT and GNR Interconnects" in Lambert Academic Publishers (2019).
2. Published a Book Chapter on "Modelling Interconnects for Future VLSI Circuit Applications" in Book entitled "VLSI and Post-CMOS Devices, Circuits and Modelling" published by IET (2019).
3. Published a Book Chapter on "Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models" in Book entitled "Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design" published by CRC Press (2023).
List Of Research Publications (only in Peer-reviewed
Journals)
International Journals (Selected)
14. M. Kumari, N. K. Singh, V. Kumar and M. Sahoo, “Design and investigation of charge plasma-based TMD heterojunction TFET biosensor for ultrasensitive detection", Springer Nature Scientific Reports (Accepted), 2025, DOI: 10.1038/s41598-024-84677-6.
13. B. Kumari, R. Y. Sharma and M. Sahoo, “ABCD parameter based analytical AC modeling of novel Cu–carbon hybrid interconnects for noise constrained nanoscale systems ”, Springer Nature Scientific Reports (Accepted), 2025, DOI: 10.1038/s41598-024-81729-9.
12. N. K. Singh and M. Sahoo, “Analytical Modeling of Short-Channel TMD TFET Considering Effect of Fringing Field and 2-D Junctions Depletion Regions”, IEEE Transactions on Electron Devices, IEEE Publishers, February, 2022, vol. 69, no. 2, pp. 843-850, DOI: 10.1109/TED.2021.3135367.
11. N. K. Singh and M. Sahoo, “Analytical Modeling of Short-Channel TMD TFET Considering Effect of Fringing Field and 2-D Junctions Depletion Regions”, IEEE Transactions on Electron Devices, IEEE Publishers, February, 2022, vol. 69, no. 2, pp. 843-850, DOI: 10.1109/TED.2021.3135367.
10. B. Kumari, P. Santosh, R. Y. Sharma and M. Sahoo, “Thermal-Aware Modeling and Analysis of Cu-Mixed CNT Nanocomposite Interconnects", IEEE Transactions on Nanotechnology, IEEE Publishers, vol. 21, pp. 163-171, 2022, DOI: 10.1109/TNANO.2022.3160870.
9. M. Sahoo, P. Ghosal, and H. Rahaman, “Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube Bundle Interconnects: An ABCD Parameter Based Approach”, IEEE Transactions on Nanotechnology, IEEE, Vol. 14, no. 2, pp. 259–274, March 2015, https://doi.org/10.1109/TNANO.2014.2388252.
8. N. K. Singh, M. Kumari and M. Sahoo, “A Compact Short-Channel Analytical Drain Current Model of Asymmetric Dual-gate TMD FET in Subthreshold Region including Fringing Field effects”, IEEE Access, IEEE Publishers, November, 2020, vol. 8, no. 11, pp. 207982--207990, DOI: 10.1109/ACCESS.2020.3038421.
7. B. Kumari, R. Kumar, R. Y. Sharma and M. Sahoo, “Design, Modeling and Analysis of Cu-Carbon Hybrid Interconnects”, IEEE Access, August 2021, vol. 9, pp. - 113577-113584, DOI: 10.1109/ACCESS.2021.3104299.
6. B. Kumari, R. Y. Sharma and M. Sahoo, “Electro-Thermal Modeling and Reliability Analysis of Cu-Carbon Hybrid Interconnects for Beyond-CMOS Computing", Applied Physics Letters, 2022, DOI: https://doi.org/10.1063/5.0101329.
5. M. Kumari, N. K. Singh and M. Sahoo, “A detailed investigation of dielectric-modulated dual-gate TMD FET based label-free biosensor via analytical modelling", Springer Nature Scientific Reports, 12:21115, 2022, DOI: https://doi.org/10.1038/s41598-022-24677-6, Link for the paper: https://rdcu.be/c09iE.
4. B. Kumari, R. Y. Sharma and M. Sahoo, “Performance and Reliability Improvement in Intercalated MLGNR Interconnects using Optimized Aspect Ratio”, Nature Scientific Reports, 12:1475, 2022, DOI: 10.1038/s41598-022-05222-x, Link for the paper: https://rdcu.be/cFOQT.
3. N. K. Singh, M. Kumari and M. Sahoo, "All Region Analytical Modeling of 2-D Transition Metal Dichalcogenide FET by Considering effect of Fringing field and Region-wise Mobility", Physica E: Low-dimensional Systems and Nanostructures, 2022, DOI: https://doi.org/10.1016/j.physe.2022.115480.
2. M. Kumari, N. K. Singh, M. Sahoo and H. Rahaman, “Work function optimization for Enhancement of sensitivity of Dual Material(DM), Double gate(DG), Junctionless MOSFET based biosensor”, Applied Physics A, Springer, January, 2021, DOI: https://doi.org/10.1007/s00339-020-04256-0.
1. N. K. Singh, and M. Sahoo, "Comparative Investigation of Different Doping Techniques in TMD Tunnel FET for Subdeca Nanometer Technology Nodes", Journal of Electronic Materials, May, 2023, DOI :10.1007/s11664-023-10505-8, Link: https://rdcu.be/ddEh2.
Papers in conference abstract volumes / presented
International Conferences(Selected)
12. B. Kumari, R. Sharma and M. Sahoo, "Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects", IEEE ECTC, 2022, pp. 1-6, DOI: 10.1109/ECTC51906.2022.00158.
11. B. Kumari, S. Pandranki, M. Sahoo, R. Sharma, “Copper-MWCNT Composite: A Solution to Breakdown in Copper Interconnects”, 2021 IEEE 21st International Conference on Nanotechnology (NANO), July 2021, DOI: 10.1109/NANO51122.2021.9514276.
10. B. Kumari, R. Kumar, M. Sahoo and R. Sharma, "Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects", Proceedings of the 71st IEEE Electronic Components and Technology Conference, Lake Buena Vista, May 2021, DOI: 10.1109/ECTC32696.2021.00256.
9. M. Kumari, and M. Sahoo, "Sensitivity Enhancement of TMD MOSFET-Based Biosensor by Modeling and Optimization of Back Gate Parameters", IEEE VLSID, January 2024, DOI: 10.1109/VLSID60093.2024.00007.
8. S. K. Dora, H. B. Mishra, M. Sahoo and K. Yadav, "Hardware Implementation of OTFS Modulation Using CORDIC Algorithm", IEEE SPCOM, August, 2024, DOI: 10.1109/SPCOM60851.2024.10631593.
7. R. Kumar, B. Kumari, S. Kumar, M. Sahoo and R Y. Sharma, “Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Shenzhen, China, December 2020, DOI: 10.1109/EDAPS50281.2020.9312905.
6. M. Sahoo, P. Ghosal, and H. Rahaman, “An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube undle Interconnects”, IEEE 27th International Conference on VLSI Design, IIT Bombay, India, pp. 433-438, Jan. 5–9, 2014,https://doi.org/10.1109/VLSID.2014.81.
5. S. Chakraborty, M. Sahoo and H. Rahaman, ``A 1.8 V 64.9 uW 54.1 dB SNDR 1st Order Sigma-Delta Modulator Design Using Clocked Comparator Based Switched Capacitor Technique”, IEEE Asia Symposium and Exhibit on Quality Electronic Design (ASQED), 2013, pp. 220-226, https://doi.org/10.1109/ASQED.2013.6643591.
4. M. Sahoo, P. Ghosal, and H. Rahaman, “An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Single-Walled Carbon Nanotube Bundle Interconnects”, IEEE/ACM Asia Symposium and Exhibit on Quality Electronic Design (ASQED), Penang, Malaysia, pp. 264-273, Aug. 26–28, 2013, https://doi.org/10.1109/ASQED.2013.6643598.
3. M. Sahoo and H. Rahaman, “Performance Analysis of Multiwalled Carbon Nanotube Bundles”, 33rd IEEE International Scientific Conference Electronics and Nanotechnology (ELNANO), NTUU, Ukraine, pp. 200-204, Apr. 16–19, 2013, https://doi.org/10.1109/ELNANO.2013.6552004.
2. M. Sahoo, P. Ghosal, and H. Rahaman, “Efficient and Compact Electrical Modeling of Multi Walled Carbon Nanotube Interconnects”, 3rd IEEE International Symposium on Electronic System Design (ISED), Bengal Engineering and Science University, Shibpur Howrah, India, pp. 236-240, Dec. 19–22, 2012, https://doi.org/10.1109/ISED.2012.24.
1. S. A. Kannan, M. Sahoo, S. Dwivedi, B. Amrutur and N. Bhat, ``Optimal Power and Noise Allocation for Analog and Digital Sections of a Low Power Radio Receiver”, ACM/IEEE ISLPED, India, August, 2008, pp. 271-276, https://doi.org/10.1145/1393921.1393993.
Patents
Indian Patent filed on “2D dual gate biosensor FET device and method of performance evaluation of the device in nanometric scale through multiscale simulation approach”, December, 2024.